Description
Rapid curing multi-purpose epoxy adhesive and encapsulating resin. Clear, permanent non-shrinking bonds. Works down to -40C when cured. Bonds rigid, durable substrates, such as metal, glass, etc. in five minutes or less.
Clear, permanent non-shrinking bonds
Works down to -40C when cured
Bonds rigid, durable substrates, such as metal, glass, ceramics, concrete and wood in five minutes or less
Working time: 3-6 minutes
Bonding time: 10-15 minutes

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